8-12 inch wafer RFID chip packaging and IoT intelligent terminal manufacturing base by Laxen Technology

The total investment of the project is not less than 500 million CNY, which is developed for RFID 8-12 inch wafer RFID chip packaging and IoT intelligent terminals manufacturing. It is committed to achieving China’s largest and the world's top three RFID chip packaging capacity, establishing a manufacturing base for IoT core hardware, including supporting intelligent terminals, and other products. It is also a platform for the industrialization of intelligent components and devices based on integrated wireless radio frequency identification and artificial intelligence (RFID-AI) technology, provide advanced solutions for smart IoT applications.